Micron Technology recently made headlines by announcing that its LPDDR5X DRAM and Universal Flash Storage (UFS) 3.1 have been qualified for the Snapdragon XR2 Gen 2 Platform. This qualification means that hardware designers and developers working on extended reality (XR) devices can now leverage these high-performance memory solutions for their products.
According to the announcement, Micron’s LPDDR5X and UFS 3.1 offer accelerated speed, improved performance, and lower power consumption. These features are crucial for devices requiring smaller form factors, such as virtual and mixed reality (VR/MR) headsets. Micron’s flagship memory solution boasts advanced 1-alpha process node technologies and JEDEC power enhancements, reaching speeds of up to 8.533 gigabytes per second (Gbps).
The collaboration between Micron and Qualcomm aims to provide single-chip architectures for immersive VR/MR experiences, allowing headset manufacturers to produce thinner and more ergonomic devices without the need for external battery packs. Micron’s UFS 3.1 client storage further complements this by offering high storage density NAND, minimizing its footprint in devices and enabling clutter-free integrations into immersive headsets.
The announcement from Micron comes at a time when the global VR/AR market is poised for significant growth, with projections indicating that it will surpass $200 billion by 2030. Micron’s advanced memory solutions are well-positioned to support the industry’s hardware efforts and drive accelerated customer adoption rates for XR devices.
Chris Jacobs, Vice President and General Manager of Embedded Market Segments at Micron, emphasized the role of high-performance and low-power hardware in bringing the metaverse to life. He stated that Micron’s LPDDR5X and UFS 3.1 solutions are poised to serve as the foundation for the next generation of XR devices, unlocking rich virtual worlds with their performance and power capabilities.
The announcement from Micron also aligns with the broader context of the semiconductor industry, particularly in the United States. Qualcomm’s collaboration with Meta Platforms and OPPO, along with Micron’s technological advancements, reflects the growing focus on strengthening and building domestic semiconductor capabilities.
In a recent earnings report, Cristiano Amon, President and Chief Executive of Qualcomm, highlighted the company’s collaboration with Meta Platforms on developing the Quest 3 mixed reality headset. The partnership resulted in enhanced graphical performance, higher resolution, and a slimmer form factor for the Quest 3, powered by Qualcomm’s next-generation Snapdragon XR platform.
These developments in the semiconductor industry are indicative of efforts by the US government to support and bolster the domestic manufacturing of semiconductor chips. The Creating Helpful Incentives to Produce Semiconductors for America (CHIPS) Act, which allocates significant funds to support research, development, and manufacturing in the semiconductor sector, underscores the strategic importance of semiconductor technology to the modern economy.
In conclusion, Micron’s qualification of its LPDDR5X DRAM and UFS 3.1 for the Snapdragon XR2 Gen 2 Platform represents a significant milestone in the advancement of memory solutions for XR devices. These developments, combined with broader initiatives in the semiconductor industry, signal a concerted effort to drive innovation, competitiveness, and self-sufficiency in the field of advanced semiconductor technologies.
